[PRNewswire] NEXCOM Collaborates with Partners to Introduce Patented
Innovation of Ultra High-Speed Signal Design
(TAIPEI, Taiwan, Feb. 27, 2019 PRNewswire=연합뉴스) NEXCOM, a leader in network communication and network security industries, partnered up with ITRI (Industrial Technology Research Institute), FHT (First Hi-Tec), and TUC (Taiwan Union Technology Corp.) to co-develop new technology to overcome design challenge of high-speed signaling. This innovative technology will be applied to high end network equipment in telecommunication industry and expected to be available in Q2 2019.
The innovation encompasses 3 new technology, including a new type of 'Ultra Low Loss' material called TUC3, whereas the Insertion loss can reach as minimal as -0.57dB/inch @25Gbps. Another brainchild, named Coaxial VIA, is an innovative technology that outperforms in signal simulation through traditional Pass Through Hole (PTH) VIA. Coaxial VIA in PCB layout is able to maintain better signal integrity in high speed signal, compared with traditional PTH VIA in PCB FAB. The third innovation is the embedded capacitor layered in PCB FAB instead of current mainstream SMD type capacitor. By using such embedded capacitor, it reduces the circuitry traces by 50% and as a result greatly enhances the signal integrity since it cuts down much of the Synchronized Switching Noise generated by high speed IC chip (such as Mellanox ConnectX-5, etc).
NEXCOM has developed a 100G LAN module showcasing the three innovation put together by the 4-party alliance. "These three patented innovative technologies allow high speed signal to extend the length up to 14," according to Matthew Liou, Product Line Director of NEXCOM Network Communication Solutions Business Group. "When the module is tested in Intel Skylake-EP based NEXCOM NSA7146 and runs under NEXCOM's own DPDK, we witness impressive figures of throughput. We achieve this without any addition of repeaters, re-timers and any other active component in hardware design to safeguard its signal integrity and at the same time, to maintain the desired performance."
In 5G era, this revolutionary innovation will bring to the world new generation high-speed, broad-band network equipment, as embodied in this milestone-marking 100G LAN module developed by NEXCOM International, a true breakthrough in high speed signal design. For more information, please visit NEXCOM website and check on the whitepaper published on this innovation at below link.
http://www.nexcom.com/news/Detail/ultra-high-speed-signal-design-its-innovation-and-application-to-high-end-network-platforms
About NEXCOM: Founded in 1992 and headquartered in Taipei, Taiwan, NEXCOM is committed to being your trustworthy partner in building the intelligent solutions. NEXCOM integrates its capabilities and operates ten global businesses, which are Network and Communication Solutions (NCS), Intelligent Platform & Services (IPS), Mobile Computing Solutions (MCS), Medical & Healthcare Informatics (MHI), Intelligent Digital Security (Green Base), Smart Manufacturing Solutions (NexAIOT), Robot & Smart Machines (NexCOBOT), Industrial Wireless Solutions (EMBUX), Education & E-Commerce (AIC), and IoT Security Solutions (TMRTek). This strategic deployment enables NEXCOM to offer time-to-market, time-to-solution products and service without compromising cost.
All trademarks are the property of their respective owners.
Source: NEXCOM
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Innovation of Ultra High-Speed Signal Design
(TAIPEI, Taiwan, Feb. 27, 2019 PRNewswire=연합뉴스) NEXCOM, a leader in network communication and network security industries, partnered up with ITRI (Industrial Technology Research Institute), FHT (First Hi-Tec), and TUC (Taiwan Union Technology Corp.) to co-develop new technology to overcome design challenge of high-speed signaling. This innovative technology will be applied to high end network equipment in telecommunication industry and expected to be available in Q2 2019.
The innovation encompasses 3 new technology, including a new type of 'Ultra Low Loss' material called TUC3, whereas the Insertion loss can reach as minimal as -0.57dB/inch @25Gbps. Another brainchild, named Coaxial VIA, is an innovative technology that outperforms in signal simulation through traditional Pass Through Hole (PTH) VIA. Coaxial VIA in PCB layout is able to maintain better signal integrity in high speed signal, compared with traditional PTH VIA in PCB FAB. The third innovation is the embedded capacitor layered in PCB FAB instead of current mainstream SMD type capacitor. By using such embedded capacitor, it reduces the circuitry traces by 50% and as a result greatly enhances the signal integrity since it cuts down much of the Synchronized Switching Noise generated by high speed IC chip (such as Mellanox ConnectX-5, etc).
NEXCOM has developed a 100G LAN module showcasing the three innovation put together by the 4-party alliance. "These three patented innovative technologies allow high speed signal to extend the length up to 14," according to Matthew Liou, Product Line Director of NEXCOM Network Communication Solutions Business Group. "When the module is tested in Intel Skylake-EP based NEXCOM NSA7146 and runs under NEXCOM's own DPDK, we witness impressive figures of throughput. We achieve this without any addition of repeaters, re-timers and any other active component in hardware design to safeguard its signal integrity and at the same time, to maintain the desired performance."
In 5G era, this revolutionary innovation will bring to the world new generation high-speed, broad-band network equipment, as embodied in this milestone-marking 100G LAN module developed by NEXCOM International, a true breakthrough in high speed signal design. For more information, please visit NEXCOM website and check on the whitepaper published on this innovation at below link.
http://www.nexcom.com/news/Detail/ultra-high-speed-signal-design-its-innovation-and-application-to-high-end-network-platforms
About NEXCOM: Founded in 1992 and headquartered in Taipei, Taiwan, NEXCOM is committed to being your trustworthy partner in building the intelligent solutions. NEXCOM integrates its capabilities and operates ten global businesses, which are Network and Communication Solutions (NCS), Intelligent Platform & Services (IPS), Mobile Computing Solutions (MCS), Medical & Healthcare Informatics (MHI), Intelligent Digital Security (Green Base), Smart Manufacturing Solutions (NexAIOT), Robot & Smart Machines (NexCOBOT), Industrial Wireless Solutions (EMBUX), Education & E-Commerce (AIC), and IoT Security Solutions (TMRTek). This strategic deployment enables NEXCOM to offer time-to-market, time-to-solution products and service without compromising cost.
All trademarks are the property of their respective owners.
Source: NEXCOM
[편집자 주] 본고는 자료 제공사에서 제공한 것으로, 연합뉴스는 내용에 대해 어떠한 편집도 하지 않았음을 밝혀 드립니다.
(끝)
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