[PRNewswire] Call for papers from Asia-Pacific Conference on Silicon Carbide
and Related Materials (GaN, AlN, BN, Ga2O3, ZnO, diamond, etc.)
(BEIJING, May 15, 2018 PRNewswire=연합뉴스) APCSCRM, sponsored by Innovation Association of Wide Bandgap Semiconductor Technology, will be a high-level conference on Silicon Carbide and Related Materials in the Asia-Pacific region. To encourage the theory, technology learning and communication in the fields of wide bandgap semiconductor material growth, device preparation and packaging, as well as device module application, the conference will conduct a paper exchange and welcomes domestic and foreign universities, research institutes and enterprising institutions of wide bandgap semiconductor materials and devices, and professional and technical personnel in the field of application contribute to participate in the exchange. Selected papers presented in APCSCRM2018 will be published in Materials Express, Diamond and Related Materials, Journal of Crystal Growth, physica status solidi (a) or Materials Science Forum. Exceptional paper authors have the opportunity to give presentations in the venue.
I. Topics.
Technical papers addressing all aspects of wide-bandgap materials, power electronics, package module and system solution or application are welcome.
II. Manuscript requirements.
1. Accept English manuscripts only;
2. Original, unpublished research results, technical review, work experience summary or technical progress report;
3. The length of the paper is not limited. (General Template: download athttp://www.apcscrm2018.iawbs.com, submission)
III. SCI/EI index searching
Both
IV. Submission instructions:
1. Submit draft via APCSCRM website (Submission Instructions: download athttp://www.apcscrm2018.iawbs.com, submission)
2. Abstract submission deadline: June 15, 2018.
3. Full paper submission deadline: July 5, 2018.
4. Please pay attention to the review status of the paper (APCSCRM online submission system).
V. Related costs
1. Paper fee
Including the layout fee and the review fee, which will be separately charged by the journal editorial department. Please refer to the contact information.
2. Payment method
(1) Bank transfer
Account name: Innovation Association of Wide Bandgap Semiconductor Technology
Bank Name: BEIJING RURAL COMMERCIAL BANK CO., LTD.
Bank Address: 3F., ShiNong Building, No.9 TianRong street, DaXing District, BeiJing China
Account No: 0905000103000006397
(in the remittance note "APCSCRM+fee category + remittance unit/author's name");
(2) Online banking, WeChat or alipay online payment (the conference website has payment links)
(payment remark "APCSCRM+ fee category + remittance unit/author's name")
3. Payment before June 9, 2018 (discounts available)
Contact: Miss Li
Telephone: +86-10-6125-6850-668
Mobile: +86-189-1080-7823
Email: liyaping@tankeblue.com
Source: Innovation Association of Wide Bandgap Semiconductor Technology
[편집자 주] 본고는 자료 제공사에서 제공한 것으로, 연합뉴스는 내용에 대해 어떠한 편집도 하지 않았음을 밝혀 드립니다.
(끝)
<저작권자(c) 연합뉴스, 무단 전재-재배포 금지>
and Related Materials (GaN, AlN, BN, Ga2O3, ZnO, diamond, etc.)
(BEIJING, May 15, 2018 PRNewswire=연합뉴스) APCSCRM, sponsored by Innovation Association of Wide Bandgap Semiconductor Technology, will be a high-level conference on Silicon Carbide and Related Materials in the Asia-Pacific region. To encourage the theory, technology learning and communication in the fields of wide bandgap semiconductor material growth, device preparation and packaging, as well as device module application, the conference will conduct a paper exchange and welcomes domestic and foreign universities, research institutes and enterprising institutions of wide bandgap semiconductor materials and devices, and professional and technical personnel in the field of application contribute to participate in the exchange. Selected papers presented in APCSCRM2018 will be published in Materials Express, Diamond and Related Materials, Journal of Crystal Growth, physica status solidi (a) or Materials Science Forum. Exceptional paper authors have the opportunity to give presentations in the venue.
I. Topics.
Technical papers addressing all aspects of wide-bandgap materials, power electronics, package module and system solution or application are welcome.
II. Manuscript requirements.
1. Accept English manuscripts only;
2. Original, unpublished research results, technical review, work experience summary or technical progress report;
3. The length of the paper is not limited. (General Template: download athttp://www.apcscrm2018.iawbs.com, submission)
III. SCI/EI index searching
Both
IV. Submission instructions:
1. Submit draft via APCSCRM website (Submission Instructions: download athttp://www.apcscrm2018.iawbs.com, submission)
2. Abstract submission deadline: June 15, 2018.
3. Full paper submission deadline: July 5, 2018.
4. Please pay attention to the review status of the paper (APCSCRM online submission system).
V. Related costs
1. Paper fee
Including the layout fee and the review fee, which will be separately charged by the journal editorial department. Please refer to the contact information.
2. Payment method
(1) Bank transfer
Account name: Innovation Association of Wide Bandgap Semiconductor Technology
Bank Name: BEIJING RURAL COMMERCIAL BANK CO., LTD.
Bank Address: 3F., ShiNong Building, No.9 TianRong street, DaXing District, BeiJing China
Account No: 0905000103000006397
(in the remittance note "APCSCRM+fee category + remittance unit/author's name");
(2) Online banking, WeChat or alipay online payment (the conference website has payment links)
(payment remark "APCSCRM+ fee category + remittance unit/author's name")
3. Payment before June 9, 2018 (discounts available)
Contact: Miss Li
Telephone: +86-10-6125-6850-668
Mobile: +86-189-1080-7823
Email: liyaping@tankeblue.com
Source: Innovation Association of Wide Bandgap Semiconductor Technology
[편집자 주] 본고는 자료 제공사에서 제공한 것으로, 연합뉴스는 내용에 대해 어떠한 편집도 하지 않았음을 밝혀 드립니다.
(끝)
<저작권자(c) 연합뉴스, 무단 전재-재배포 금지>
관련뉴스
